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  january 2009 rev 1 1/9 9 P011XX sensitive high immunity scrs up to 0.8 a features i t(rms) up to 0.8 a v drm /v rrm 400 and 600 v i gt from 0.5 to 25 a description thanks to highly sensitive triggering levels, the P011XX scr series is suitab le for all applications where available gate curr ent is limited, such as ground fault circuit interruptors, pilot circuits in solid state relays, standby mode power supplies, smoke and alarm detectors. available in through-hole or surface-mount packages, the voltage capab ility of this series has been upgraded since its introduction and is now available up to 600 v. to-92 (P011XXa) sot-223 (P011XXn) a k g a a k g a k g table 1. device summary order code voltage sensitivity package 400 v 600 v min. max. p0111da 1aa3 x 4 a 25 a to-92 p0111da 5al3 x 4 a 25 a to-92 p0111dn 5aa4 x 4 a 25 a sot-223 p0111ma 1aa3 x 4 a 25 a to-92 p0111ma2al3 (1) x 4 a 25 a to-92 p0111mn 5aa4 x 4 a 25 a sot-223 p0115da 1aa3 x 15 a 50 a to-92 p0115da 5al3 x 15 a 50 a to-92 p0118da 1aa3 x 0.5 a 5 a to-92 p0118da 5al3 x 0.5 a 5 a to-92 p0118dn 5aa4 x 0.5 a 5 a sot-223 p0118ma 2al3 x 0.5 a 5 a to-92 p0118ma 5al3 x 0.5 a 5 a to-92 1. this order code has no space. www.st.com
characteristics P011XX 2/9 1 characteristics table 2. absolute ratings (limiting values) symbol parameter value unit i t(rms) rms on-state current (180 conduction angle) to-92 t l = 55 c 0.8 a sot-223 t amb = 70 c it (av) average on-state current (180 conduction angle) to-92 t l = 55 c 0.5 a sot-223 t amb = 70 c i tsm non repetitive surge peak on-state current t p = 8.3 ms t j = 25 c 8 a t p = 10 ms 7 i 2 ti 2 t value for fusing t p = 10 ms t j = 25 c 0.24 a 2 s di/dt critical rate of rise of on-state current i g = 2 x i gt , t r 100 ns f = 60 hz t j = 125 c 50 a/s i gm peak gate current t p = 20 s t j = 125 c 1 a p g(av) average gate power dissipation t j = 125 c 0.1 w t stg t j storage junction temperature range operating junction temperature range - 40 to + 150 - 40 to + 125 c table 3. electrical characteristics (t j = 25 c, unless otherwise specified) symbol test conditio ns p0111 p0115 p0118 unit i gt v d = 12 v r l = 140 min. 4 15 0.5 a max. 25 50 5 v gt max. 0.8 v v gd v d = v drm r l = 3.3 k r gk = 1 k t j = 125 c min. 0.1 v v rg i rg = 10 a min. 8 v i h i t = 50 ma r gk = 1 k max. 5 ma i l i g = 1 ma r gk = 1 k max. 6 ma dv/dt v d = 67 % v drm r gk = 1 k t j = 125 c min. 80 75 75 v/s v tm i tm = 1.6 a tp = 380 s t j = 25 c max. 1.95 v v t0 threshold voltage t j = 125 c max. 0.95 v r d dynamic resistance t j = 125 c max. 600 m i drm i rrm v drm = v rrm = 400 v r gk = 1 k t j = 25 c max. 1 a v drm = v rrm = 600 v r gk = 1 k 10 v drm = v rrm r gk = 1 k t j = 125 c 100
P011XX characteristics 3/9 table 4. thermal resistance symbol parameter maximum unit r th(j-a) junction to case (dc) to-92 80 c/w r th(j-t) junction to tab (dc) sot-223 30 c/w r th(j-a) junction to ambient (dc) to-92 150 c/w s (1) = 5 cm 2 sot-223 60 1. s = copper surface under tab. figure 1. maximum average power dissipation versus average on-state current figure 2. average and dc on-state current versus lead temperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 p(w) = 180 360 i (a) t(av) 0 25 50 75 100 125 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 i (a) t(av) t (c) lead = 180 (sot-223) = 180 (to-92) d.c. (sot-223) d.c. (to-92) figure 3. average and dc on-state current versus ambient temperature figure 4. relative variation of thermal impedance junction to ambient versus pulse duration 0 25 50 75 100 125 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 i (a) t(av) t (c) amb = 180 (sot-223) = 180 (to-92) d.c. (sot-223) d.c. (to-92) device mounted on fr4 with recommended pad layout 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 0.01 0.10 1.00 k=[z /r th(j-a) th(j-a) ] t (s) p sot-223 to-92
characteristics P011XX 4/9 figure 5. relative variation of gate trigger, holding and latching current versus junction temperature figure 6. relative variation of holding current versus gate-cathode resistance (typical values) -40 -20 0 20 40 60 80 100 120 14 0 0 1 2 3 4 5 6 t (c) j i,i,i[t] / gt h l j i ,i ,i [t =25c] gt h l j i gt i h & i r = 1k l gk typical values 1e-2 1e-1 1e+0 1e+1 0 2 4 6 8 10 12 14 16 18 20 r(k) gk i [r ] / i [ =1k ] hgk h r gk t j = 25c figure 7. relative variation of dv/dt immunity versus gate-cathode resistance (typical values). figure 8. relative variation of dv/dt immunity versus gate-cathode capacitance (typical values) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1.0 10.0 r(k) gk dv/dt[r ] / dv/dt[ =1k ] gk r gk t j = 125c v = 0.67 x v d drm 01234567 0 2 4 6 8 10 c (nf) gk dv/dt[c ] / dv/dt[ =1k ] gk r gk t v = 0.67 x v = 125c r = 1k d drm gk j figure 9. surge peak on-state current versus number of cycles figure 10. non-repetitive surge peak on-state current and corresponding value of i2t i (a) tsm 1 10 100 1000 0 1 2 3 4 5 6 7 8 number of cycles non repetitive t initial=25c j repetitive t =25c amb t =10ms p one cycle i (a), i t (a s) tsm 22 100.0 10.0 1.0 0.1 0.01 0.10 1.00 10.00 t initial = 25c j i t 2 i tsm t (ms) p sinusoidal pulse with width t < 10ms p
P011XX ordering information scheme 5/9 2 ordering information scheme figure 13. ordering information scheme figure 11. on-state characteristics (maximum values) figure 12. thermal resistance junction to ambient versus copper surface under tab i (a) tm 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1e+1 1e+0 1e-1 1e-2 v =0.95v r =600m t max.: j t0 d v (v) tm t j =max t =25c j 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 130 120 110 100 90 80 70 60 50 40 30 20 10 0 s(cm2) r (c/w) th(j-a) epoxy printed circuit board fr4, copper thickness: 35 m sensitive scr series sensitivity voltage package packing mode current 01 up to 0.8 a 11 = 4 to 25 a 15 = 15 to 50 a 18 = 0.5 to 5 a d = 400 v m = 600 v a = to-92 n = sot-223 1aa3 = bulk 2al3 = ammopack 5al3 = tape and reel 13 inch 5aa4 = tape and reel 7 inch blank p 01 1x x x xaxx
package information P011XX 6/9 3 package information epoxy meets ul94, v0 in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. to-92 dimensions ref dimensions millimeters inches min typ max min typ max a 1.35 0.053 b4.700.185 c 2.54 0.100 d4.40 0.173 e 12.70 0.500 f3.700.146 a0.500.019 a f c b a de
P011XX package information 7/9 figure 14. footprint (dimensions in mm) table 6. sot-223 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 1.80 0.071 a1 0.02 0.001 b 0.60 0.70 0.80 0.024 0.027 0.031 b1 2.90 3.00 3.10 0.114 0.118 0.122 c 0.24 0.26 0.32 0.009 0.010 0.013 d 6.30 6.50 6.70 0.248 0.256 0.264 e 2.3 0.090 e1 4.6 0.181 e 3.30 3.50 3.70 0.130 0.138 0.146 h 6.70 7.00 7.30 0.264 0.276 0.287 v10 max a a1 e1 d b1 h e e 12 4 3 b v c 3.25 1.32 7.80 5.16 1.32 2.30 0.95
ordering information P011XX 8/9 4 ordering information 5 revision history table 7. ordering information order code marking package weight base qty packing mode p0111da 1aa3 p0111 da to-92 0.2 g 2500 bag p0111da 5al3 p0111 da to-92 0.2 g 2000 tape and reel 13 inch p0111dn 5aa4 p1d sot-223 0.11 g 1000 tape and reel 7 inch p0111ma 1aa3 p0111 ma to-92 0.2 g 2500 bag p0111ma2al3 (1) 1. this order code has no space. p0111 ma to-92 0.2 g 2000 ammopack p0111mn 5aa4 p1m sot-223 0.11 g 1000 tape and reel 7 inch p0115da 1aa3 p0115 da to-92 0.2 g 2500 bag p0115da 5al3 p0115 da to-92 0.2 g 2000 tape and reel 13 inch p0118da 1aa3 p0118 da to-92 0.2 g 2500 bag p0118da 5al3 p0118 da to-92 0.2 g 2000 tape and reel 13 inch p0118dn 5aa4 p8d sot-223 0.11 g 1000 tape and reel 7 inch p0118ma 2al3 p0118 ma to-92 0.2 g 2000 ammopack p0118ma 5al3 p0118 ma to-92 0.2 g 2000 tape and reel 13 inch table 8. document revision history date revision description of changes 26-jan-2009 1 first issue.
P011XX 9/9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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